2027 Undergrad Firmware Engineering Intern/Co-op

AMD·New York·United States·Embedded & Firmware Engineering

AMD is hiring a 2027 Undergrad Firmware Engineering Intern/Co-op in New York. Posted 2026-08-20; applications close 2026-10-19 (in 58 days).

Role details

AMD Intern / Co-op — Firmware Engineering

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

As an AMD intern and co-op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.

Job Details

  • Locations: Austin, TX; Boxborough, MA; Fort Collins, CO; Longmont, CO; Fishkill, NY; Rochester, NY; Secaucus, NJ
  • Onsite/Hybrid: This role requires the student to work full time (40 hours a week), in either a hybrid or onsite work structure throughout the duration of the co-op/intern term.
  • Duration:
    • Spring/Summer Co-op: January 15, 2027 - August 13, 2027
    • Summer Internship:
      • Semester Students: May 24, 2027 - August 13, 2027
      • Quarter Students: June 21, 2027 - September 10, 2027
    • Summer/Fall Co-op:
      • Semester Students: May 24, 2027 - December 10, 2027
      • Quarter Students: June 21, 2027 - December 10, 2027

What You Will Be Doing

We are seeking a highly motivated Firmware Engineering intern/co-op to join our team and work with team members in the support, design, development, and delivery of firmware for AMD’s discrete and embedded products.

  • Craft, implement, debug, and validate features on reference hardware and software, pre-silicon emulation, and simulation environments supporting AMD products.
  • Actively participate in design reviews, code reviews, and project planning.
  • Build and complete clear documentation for all software produced.
  • Work on both internal and external platforms.
  • Learn and apply Agile methodologies and standard processes for software engineering.
  • May be involved in one or more of the following:
    • Engage in x86 firmware development using C.
    • Design, build, and implement embedded firmware + boot ROM/hardware.
    • Debug issues at the boundary of firmware and hardware, including involvement in waveform-level analysis to root-cause FW/HW issues.

Who We Are Looking For

  • Currently enrolled in a US-based university in a Bachelor’s program majoring in Electrical Engineering, Computer Science, Computer Engineering, or a related field.
  • If you have knowledge or experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply:
    • Low-level BIOS, firmware, or system software development
    • Low-level programming language C/C++ and knowledge of hardware architectures
    • Embedded system, RTOS, and embedded controller structure
    • Source control, debuggers, compilers, and system-wide debugging from software to firmware to hardware
    • Open-source concepts
    • VHDL/Verilog/FPGA and general hardware design concepts and process
    • Linux development environments
    • Architectural understanding and/or experience of graphics/compute pipelines
    • Perforce, JIRA, Git, or similar tools

Note: By submitting your application, you are indicating your interest in AMD intern positions. We are recruiting for multiple positions, and if your experience aligns with any of our intern opportunities, a recruiter will contact you.

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

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This 2027 Undergrad Firmware Engineering Intern/Co-op role at AMD runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.

Jorb AI tracks details for 2027 Undergrad Firmware Engineering Intern/Co-op at AMD. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-08-22.

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