2027 Undergrad ASIC Package Engineering Co-op/Intern

About AMD

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger—technology that moves the world forward. Join us and, together, we’ll advance your career.

Intern / Co-op Overview

As an AMD intern or co-op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.

Job Details

• Location: Austin, TX or Boxborough, MA; summer only: Fishkill, NY; Fort Collins, CO; Longmont, CO; or Secaucus, NJ
• Onsite/Hybrid: This role requires the student to work full time (40 hours a week), in either a hybrid or onsite work structure throughout the duration of the co-op/intern term
• Duration:
  • Spring/Summer Co-op: January 25, 2027 – August 13, 2027
  • Summer Internship:
    • Semester Schools: May 24, 2027 - August 13, 2027
    • Quarter Schools: June 21, 2027 – September 10, 2027
  • Summer-Fall Co-op:
    • Semester Schools: May 24, 2027 – December 10, 2027
    • Quarter Schools: June 21, 2027 – December 10, 2027

What You Will Be Doing

AMD is seeking a highly motivated ASIC Package Engineering intern/co-op to join the team and work with engineers to bring new and advanced packaging technology to reality. In this role, you will:

• Support Package Design and Package Development Engineers by prioritizing and optimizing new projects
• Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates (with training)
• Work on projects related to design verification implementation to ensure design performance, quality, and efficiency
• Analyze yield and defect metrics to ensure design performance and help improve yield
• Evaluate and benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials while meeting performance and yield requirements

Who We Are Looking For

• Currently enrolled in a US-based university in a Bachelors degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
• Knowledge or experience in one or more of the following technical skills (or related areas) and enthusiasm for the role:
  • Coursework related to transmission lines and electric circuits
  • Package, silicon, or PCB design software
  • Scripting languages: Perl / Python / SQL
  • Semiconductor theory and packaging process/technology
  • Data analytics and data visualization tools such as Power BI

Additional Information

Note: By submitting your application, you are indicating your interest in AMD intern positions. We are recruiting for multiple positions, and if your experience aligns with any of our intern opportunities, a recruiter will contact you.

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.