Wafer Sort/Final Test Thermal Mechanical hardware development Engineer Intern

AMD·Singapore·Mechanical Engineering

AMD is hiring a Wafer Sort/Final Test Thermal Mechanical hardware development Engineer Intern in Singapore. Posted 2026-08-25; applications close 2026-10-24 (in 56 days).

Role details

Intern- Wafer Sort/Final Test Thermal Mechanical Hardware Development Engineer (AMD)

At AMD, we believe technology has the power to solve the world’s most important challenges. Innovation at AMD is shaping the future—from advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger—technology that moves the world forward.

As an AMD [intern/co-op], you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide.

Location

Singapore

Criteria

Current students studying in universities based in Singapore.

Internship Duration

The internship begins on 4 Jan 2027 and ends on 28 May 2027. There is an option to extend the internship, with the extended period concluding on a fixed date of 6 Aug 2027.

What You Can Expect to Learn

  • Gain industry experience working on development projects.
  • Develop systematic project management skill sets.
  • Learn about popular handler platforms and change kit design for ATE FT testing.

Project Overview

Involve in developing wafer sort/final test thermal mechanical hardware.

  • Dynamic BOM generation for an ATE hardware development project.
  • ATE hardware mechanical CIP projects.

Key Responsibilities

  • Acquire basic knowledge for ATE testing hardware.
  • Understand hardware differences across handler platforms and help define generic standards for OSAT.
  • Support mechanical design modifications based on engineering change requests.
  • Participate in design reviews and engineering discussions.
  • Help verify design compliance with company standards and manufacturing requirements.

Who Are We Looking For

  • Basic mechanical engineering background and ability to develop data analysis in the field.

Relevant Skillsets

  • Basic understanding of mechanical engineering principles.
  • Familiarity with at least one CAD software package (e.g., SolidWorks).
  • Basic programming skills in Python, JavaScript, or similar languages.
  • Strong analytical and problem-solving skills.
  • Good communication and teamwork abilities.

Academic Credentials

  • Degree in Mechanical Engineering / Mechatronics Engineering / Manufacturing Engineering / Data Science (with engineering interest).

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This Wafer Sort/Final Test Thermal Mechanical hardware development Engineer Intern role at AMD runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.

Jorb AI tracks details for Wafer Sort/Final Test Thermal Mechanical hardware development Engineer Intern at AMD. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-08-28.

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