College Intern - Packaging Engineering
HP·Singapore·Mechanical Engineering
HP is hiring a College Intern - Packaging Engineering in Singapore. Posted 2026-08-26; applications close 2026-10-25 (in 57 days).
Role details
College Intern - Packaging Engineering (HP)
Description
What a College Intern - Packaging Engineering does at HP:
- Support the design and development of packaging solutions for Ink Supplies products under the guidance of experienced packaging engineers.
- Assist in creating packaging concepts, specifications, drawings, and documentation.
- Participate in packaging validation and qualification activities, including testing for form, fit, function, shock, vibration, compression, and environmental performance.
- Collect, analyze, and summarize test data; prepare reports and recommendations for engineering review.
- Support packaging cost reduction, sustainability, and efficiency improvement initiatives.
- Assist with qualification builds, manufacturing trials, and packaging implementation activities.
- Collaborate with cross-functional teams, including Quality, Manufacturing, Procurement, Marketing, and NPI, to support project objectives.
- Conduct research on packaging materials, emerging technologies, industry trends, and sustainability opportunities.
- Maintain engineering documentation, packaging specifications, and project records.
- Present project updates, findings, and recommendations to engineering teams as appropriate.
Qualifications
- Currently pursuing a Bachelor’s or Master’s degree in Packaging, Mechanical, Industrial, Manufacturing Engineering, Materials Science, or related.
- Able to commit for a 5–6 months full-time internship starting in January 2027.
- Previous internship, academic project, or laboratory experience related to packaging, product development, manufacturing, or testing.
- Basic understanding of packaging design principles, materials, and manufacturing processes.
- Interest in sustainability, circular economy principles, and environmentally responsible packaging solutions.
- Strong analytical and problem-solving skills.
- Ability to organize data, perform analysis, and draw practical conclusions.
- Proficiency in Microsoft Office applications (Excel, PowerPoint, Word).
- Familiarity with CAD tools (SolidWorks, Creo, NX, AutoCAD, TOPS, or similar) is a plus.
- Ability to work collaboratively in a team environment.
- Eagerness to learn and apply engineering fundamentals in a real-world setting.
- Demonstrated initiative, adaptability, and attention to detail.
Role Details
- Job: Administration
- Schedule: Full time
- Shift: No shift premium (Singapore)
- Travel: Not specified
- Relocation: Not specified
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Applying to this role
This College Intern - Packaging Engineering role at HP runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.
Jorb AI tracks details for College Intern - Packaging Engineering at HP. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-08-28.
