College Intern – R&D Mechanical Engineer
HP·Singapore·Mechanical Engineering
HP is hiring a College Intern – R&D Mechanical Engineer in Singapore. Posted 2026-07-27; applications close 2026-09-25 (in 55 days).
Role details
College Intern – R&D Mechanical Engineer
What you will do at HP
- Work with the R&D team on printer product development.
- Document design rules across various areas of product design.
- Use CAD software to design mechanical parts for printer products.
- Use simulation and artificial intelligence software to assess design robustness.
- Support the full design process from design intent through prototype.
- Establish optimized machine settings and test specifications to maximize yield gain while reducing cycle time.
- Develop loss functions using statistical testing to validate test specifications and filter defects.
Who you are
- Currently pursuing a degree in Mechanical Engineering.
- Available for a full-time internship from January 2027 for 5–6 months.
- Strong analytical thinking, project management, and problem-solving skills.
- Fundamental knowledge of mechanical product design.
- Mechanical drawing skills using CAD software are an added advantage.
- Passion for hands-on projects.
Job Details
- Job: Administration
- Schedule: Full time
- Shift: No shift premium (Singapore)
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Applying to this role
This College Intern – R&D Mechanical Engineer role at HP runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.
Jorb AI tracks details for College Intern – R&D Mechanical Engineer at HP. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-07-31.
