College Intern – R&D Mechanical Engineer

HP·Singapore·Mechanical Engineering

HP is hiring a College Intern – R&D Mechanical Engineer in Singapore. Posted 2026-07-27; applications close 2026-09-25 (in 55 days).

Role details

College Intern – R&D Mechanical Engineer

What you will do at HP

  • Work with the R&D team on printer product development.
  • Document design rules across various areas of product design.
  • Use CAD software to design mechanical parts for printer products.
  • Use simulation and artificial intelligence software to assess design robustness.
  • Support the full design process from design intent through prototype.
  • Establish optimized machine settings and test specifications to maximize yield gain while reducing cycle time.
  • Develop loss functions using statistical testing to validate test specifications and filter defects.

Who you are

  • Currently pursuing a degree in Mechanical Engineering.
  • Available for a full-time internship from January 2027 for 5–6 months.
  • Strong analytical thinking, project management, and problem-solving skills.
  • Fundamental knowledge of mechanical product design.
  • Mechanical drawing skills using CAD software are an added advantage.
  • Passion for hands-on projects.

Job Details

  • Job: Administration
  • Schedule: Full time
  • Shift: No shift premium (Singapore)

More open roles at HP

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Applying to this role

This College Intern – R&D Mechanical Engineer role at HP runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.

Jorb AI tracks details for College Intern – R&D Mechanical Engineer at HP. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-07-31.

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