Intern - STPG PE Firmware

About the Team

Join an inclusive team passionate about using expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help enable everything from virtual reality experiences to breakthroughs in neural networks. We commit to integrity, sustainability, and giving back to our communities.

Location

Micron Singapore Bendemeer (MSB), Singapore

Department

Storage Technology Product Group, Product Engineering Firmware

Project Title

AI-Enabled Manufacturing Firmware Development and SSD Failure Analysis

Project Description

The intern will undertake an engineering project focused on Manufacturing Test Firmware development for Solid-State Drive (SSD) test and validation environments.

Under engineer guidance, the intern will develop firmware features, evaluate test coverage, and apply Artificial Intelligence tools to code generation, validation, log analysis, and failure investigation. The project provides exposure to firmware development, embedded systems, manufacturing data, and AI-Enabled engineering workflows.

Objective of the Project

• Develop Manufacturing Test Firmware for a defined SSD test use case.
• Improve firmware validation, test coverage, or test efficiency.
• Apply AI-assisted tools to code development and software verification.
• Evaluate an Agentic AI solution for log analysis, failure triage, or root-cause investigation.

Project Scope

• Translate selected manufacturing-test requirements into firmware designs and test methods.
• Develop and validate firmware features using C, C++, Python, or relevant embedded-development tools.
• Apply an AI Assistant or Generative AI to code generation, review, test automation, and validation.
• Analyze manufacturing or product-return data to identify trends and test-coverage opportunities.
• Develop or evaluate an Agentic AI workflow for firmware debugging, log analysis, or failure investigation.

Learning Opportunities

• Gain experience in SSD firmware, embedded systems, and manufacturing-test development.
• Learn firmware design, code review, debugging, validation, and test-coverage methods.
• Collaborate with Product Engineering, Test Process Engineering, algorithm, and hardware teams.
• Explore Generative AI, Large Language Models, and Agentic AI for firmware engineering.

Deliverables

• A developed and validated Manufacturing Test Firmware feature or prototype.
• Test results covering functionality, reliability, performance, or test efficiency.
• An AI-Enabled prototype for code validation, log analysis, or failure investigation.
• Technical documentation outlining the methodology, results, limitations, and recommendations.

Impact of the Project

• Improve Manufacturing Test Firmware capability or validation efficiency.
• Strengthen test coverage and SSD failure detection.
• Reduce repetitive analysis through AI-Enabled automation.
• Demonstrate practical Artificial Intelligence applications in firmware engineering.

Skillsets Required

• Programming knowledge in C, C++, Python, firmware development, or embedded systems.
• Strong analytical, problem-solving, communication, and project-management skills.
• Familiarity with Peripheral Component Interconnect Express (PCIe) or storage interfaces would be advantageous.
• Interest in Generative AI, Large Language Models, AI-assisted development tools, or AI agents.
• Ability to learn technical concepts and communicate findings clearly.

Course of Interest

The ideal candidate should be pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, or a related technical field.

Duration

The ideal candidate should be able to commit to a full-time internship period of 5 months from Jan to May 2027.

Opportunities for Full-Time Employment

Interns may be considered for future internship or full-time employment opportunities based on business needs, role availability, academic completion, and demonstrated capabilities.