College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)
Applied Materials·Singapore·Research / Applied Science
Applied Materials is hiring a College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging) in Singapore. Posted 2026-09-07; applications close 2026-11-06 (in 58 days).
Role details
Who We Are
Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry.
What We Offer
Location: Singapore, SGP
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go.
Role Scope
With engineer’s guidance, you will perform, collect data, and analyze unusually complex experiments to develop complicated physical vapor deposition (PVD) products.
Job scope including:
- PVD process optimization and measurement of metal film properties; organize data and reports for review.
- Perform hardware characterization on moderately difficult systems, within safety guidelines.
- With engineer’s guidance, participate in troubleshooting moderately complex problems by performing Root Cause Analysis and resolving moderately difficult process engineering issues.
Learning Outcome
- Able to think constructively, solve problems creatively, and bring new possibilities to life.
- Be able to participate in innovation cycles for new products.
- Learn leading-edge semiconductor technologies and engage with various problem-solving opportunities for top semiconductor foundries.
Additional Information
- Time Type: Full time
- Employee Type: Intern / Student
- Travel: No
- Relocation Eligible: No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
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Applying to this role
This College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging) role at Applied Materials runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.
Jorb AI tracks details for College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging) at Applied Materials. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-09-08.
