College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding
Applied Materials·Singapore·Research / Applied Science
Applied Materials is hiring a College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding in Singapore. Posted 2026-09-04; applications close 2026-11-03 (in 59 days).
Role details
Who We Are
Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.
What We Offer
Location: Singapore, SGP
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go.
Internship Overview
The intern will support the development and validation of overlay metrology and defect inspection applications for a die-to-wafer hybrid bonding cluster system. The role involves engineering data analysis, image processing, and development of software utilities to improve measurement, inspection, and workflow efficiency.
Key Responsibilities
- Support metrology and defect inspection application development and testing.
- Analyze measurement and inspection data to evaluate system performance.
- Develop scripts and software tools for data processing, visualization, and automation.
- Apply image processing techniques for defect analysis and characterization.
- Prepare technical reports and collaborate with cross-functional engineering teams.
Additional Information
- Time Type: Full time
- Employee Type: Intern / Student
- Travel: No
- Relocation Eligible: No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
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Applying to this role
This College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding role at Applied Materials runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.
Jorb AI tracks details for College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding at Applied Materials. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-09-04.
