Intern – Package Development Engineering (Advanced Packaging, High Bandwidth Memory & New Product Introduction)

Intern – Package Development Engineering (Advanced Packaging, High Bandwidth Memory & New Product Introduction)

Project Title: Evaluation and Analysis of Advanced Packaging Technologies for High Bandwidth Memory Development

Project Description:
This project focuses on the study and evaluation of advanced semiconductor packaging technologies, including High Bandwidth Memory solutions, within a development engineering environment. The intern will explore how new packaging technologies are designed, analysed, and prepared for manufacturing by applying data-driven methods and engineering principles. The project emphasises structured learning through analysis, experimentation concepts, and collaboration across engineering functions.

Objective of the project:
To develop an understanding of advanced packaging development processes and apply data analysis and engineering methodologies to evaluate and improve technology readiness and performance.

Project Scope:

• Study advanced semiconductor packaging concepts and development workflows
• Analyse engineering datasets related to packaging development and performance evaluation
• Apply design of experiment methodologies to organise and interpret experimental data
• Explore the use of data analysis and artificial intelligence-enabled tools for engineering studies
• Participate in project reviews to understand technology qualification and transfer concepts
• Document observations, insights, and engineering approaches through structured reporting

Learning Opportunities:

• Gain foundational knowledge of advanced packaging technologies and development processes
• Exposure to engineering methodologies such as design of experiments and risk assessment concepts
• Understanding of technology qualification and transfer into manufacturing
• Hands-on experience with data analysis and emerging digital or artificial intelligence-enabled tools
• Development of communication and collaboration skills in a cross-functional environment

Deliverables:

• Engineering analysis report summarising assigned study or dataset
• Data visualisations or dashboards demonstrating key findings
• Documented case study on the application of analytical or digital tools
• Final presentation outlining project approach, learnings, and conclusions

Impact of Project:

• Enhanced understanding of advanced packaging development and evaluation methodologies
• Contribution to data-driven approaches in analysing packaging technologies
• Development of scalable concepts for improving engineering evaluation and readiness

Skillsets Required:

• Strong analytical thinking and problem-solving skills
• Basic understanding of data analysis concepts
• Ability to organise and interpret technical data
• Good communication and teamwork skills

Course of Interests:
The ideal candidate should be currently pursuing a degree in Chemical Engineering, Materials Science, Electrical and Electronics Engineering, Mechanical Engineering, Computer Engineering, Data Science, or a related field.

Duration Period:
Minimum 3 – 6 months on a full-time basis.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website.