[2027 Internship] IC Physical Design Intern
MediaTek·Singapore·Computer Engineering
MediaTek is hiring a [2027 Internship] IC Physical Design Intern in Singapore. Posted 2026-08-20; applications close 2026-10-19 (in 58 days).
Role details
Responsibilities
- Responsible for physical design and development of a variety of SoCs (System on Chip) and tapeout.
- Execute state-of-the-art methodologies including synthesis, floor planning, place and route, RC extraction, timing and power optimization, physical verification, and PI signoff.
- Benchmark performance, power, and area to validate the robustness of the design flow.
- Implement flow development using Perl, TCL, Python, and related tools.
About the Role
MediaTek’s Physical Design team is responsible for implementing top-quality digital backend design for advanced process chips, which include billions of transistors.
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Applying to this role
This [2027 Internship] IC Physical Design Intern role at MediaTek runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.
Jorb AI tracks details for [2027 Internship] IC Physical Design Intern at MediaTek. Postings refresh hourly from primary careers pages. Job details mirror the firm's posting; the apply link goes directly to the source. Last refreshed 2026-08-22.
