# Silicon Photonics Advanced Packaging Intern (Summer 2027) [GlobalFoundries](https://www.jorb.ai/firms/globalfoundries.md) · New York · United States · [Electrical Engineering](https://www.jorb.ai/jobs/electrical-engineering.md) GlobalFoundries is hiring a Silicon Photonics Advanced Packaging Intern (Summer 2027) in New York. Posted 2026-09-03; applications close 2026-11-02. **Apply**: https://globalfoundries.wd1.myworkdayjobs.com/External/job/USA---New-York---Malta/Silicon-Photonics-Advanced-Packaging-Intern--Summer-2027-_JR-2604270 Posted 2d ago. ## Role details ## About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com. ## Internship Program Overview Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives. ## Summary of Role GlobalFoundries (GF) is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF’s Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements. ## Essential Responsibilities - Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners. - Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products. - Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders. - Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness. ## Other Responsibilities - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. ## Required Qualifications - Education: Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related field through an accredited degree program during the internship. - Must have at least an overall 3.0 GPA and be in good academic standing. - Language Fluency: English (written & verbal). - Travel: Up to 10%. - Ability to work at least 40 hours per week during the internship. ## Preferred Qualifications - Prior related internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics. - Demonstrated leadership experience through academic projects, student organizations, competitions, or prior employment. - Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making. - Project management skills and the ability to innovate and execute solutions in ambiguous environments. - Strong written and verbal communication skills. - Strong planning and organizational skills. - Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools. - Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics is a plus. ## Expected Salary Range $20.00 - $40.00 The exact salary will be determined based on qualifications, experience, and location. ## Applying to this role This Silicon Photonics Advanced Packaging Intern (Summer 2027) role at GlobalFoundries runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications. [Tailor this application](https://www.jorb.ai/signup?ref=job-atom&firm=globalfoundries&job=6a999b6b9f84b24548c2c3d0) ## More open roles at GlobalFoundries - [Senior Engineer SiPh Device](https://www.jorb.ai/jobs/6a999b6b9f84b24548c2c3d5.md) – New York, posted 2d ago - [RF Technology Development Automation Engineering Intern (Summer 2027)](https://www.jorb.ai/jobs/6a999b6b9f84b24548c2c3d6.md) – New York, posted 2d ago - [IP Program Management & Quality Intern (Jan-Jun 2027)](https://www.jorb.ai/jobs/6a992a515f3281493ea64f74.md) – Singapore, posted 3d ago - [Machine Learning & Generative AI Intern (Jan-Jun 2027)](https://www.jorb.ai/jobs/6a992a515f3281493ea64f73.md) – Singapore, posted 3d ago - [Associate Engineer, Litho Equipment (300mm Fab)](https://www.jorb.ai/jobs/6a992a2d169be7face44e233.md) – Singapore, posted 3d ago ## Other open Electrical Engineering roles - [Technician, Assembly](https://www.jorb.ai/jobs/6a9961a8dc1cc89b66452941.md) at [ST Engineering](https://www.jorb.ai/firms/st-engineering.md) – Singapore, posted 1d ago - [Development of Optical Characterization Methods for Electro-Optical advanced Packaging Technologies Intern](https://www.jorb.ai/jobs/6a999a93dff6f06ecd7ac101.md) at [AMD](https://www.jorb.ai/firms/amd.md) – Singapore, posted 1d ago - [Technical Specialist I](https://www.jorb.ai/jobs/6a956deed01294cf9a42fca3.md) at [Thales](https://www.jorb.ai/firms/thales.md) – Singapore, posted 5d ago - [Intern - Process & Equipment Engineer (Diffusion)](https://www.jorb.ai/jobs/6a95385664cf0726aa58ac60.md) at [Micron Technology](https://www.jorb.ai/firms/micron-technology.md) – Singapore, posted 5d ago - [Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)](https://www.jorb.ai/jobs/6a94fec76f569f84ee625f97.md) at [Applied Materials](https://www.jorb.ai/firms/applied-materials.md) – Singapore, posted 5d ago --- Updated: 2026-09-05 Canonical: https://www.jorb.ai/jobs/6a999b6b9f84b24548c2c3d0