# College Intern - Packaging Engineering

[HP](https://www.jorb.ai/firms/hp.md) · Singapore · [Mechanical Engineering](https://www.jorb.ai/jobs/mechanical-engineering.md)

HP is hiring a College Intern - Packaging Engineering in Singapore. Posted 2026-08-26; applications close 2026-10-25.

**Apply**: https://hp.wd5.myworkdayjobs.com/ExternalCareerSite/job/Singapore-South-West-Singapore/College-Intern---Packaging-Engineering_UNI4587

Posted 2d ago.

## Role details

## College Intern - Packaging Engineering (HP)

## Description

**What a College Intern - Packaging Engineering does at HP:**

  
- Support the design and development of packaging solutions for Ink Supplies products under the guidance of experienced packaging engineers.
  
- Assist in creating packaging concepts, specifications, drawings, and documentation.
  
- Participate in packaging validation and qualification activities, including testing for form, fit, function, shock, vibration, compression, and environmental performance.
  
- Collect, analyze, and summarize test data; prepare reports and recommendations for engineering review.
  
- Support packaging cost reduction, sustainability, and efficiency improvement initiatives.
  
- Assist with qualification builds, manufacturing trials, and packaging implementation activities.
  
- Collaborate with cross-functional teams, including Quality, Manufacturing, Procurement, Marketing, and NPI, to support project objectives.
  
- Conduct research on packaging materials, emerging technologies, industry trends, and sustainability opportunities.
  
- Maintain engineering documentation, packaging specifications, and project records.
  
- Present project updates, findings, and recommendations to engineering teams as appropriate.

## Qualifications

  
- Currently pursuing a Bachelor’s or Master’s degree in Packaging, Mechanical, Industrial, Manufacturing Engineering, Materials Science, or related.
  
- Able to commit for a 5–6 months full-time internship starting in January 2027.
  
- Previous internship, academic project, or laboratory experience related to packaging, product development, manufacturing, or testing.
  
- Basic understanding of packaging design principles, materials, and manufacturing processes.
  
- Interest in sustainability, circular economy principles, and environmentally responsible packaging solutions.
  
- Strong analytical and problem-solving skills.
  
- Ability to organize data, perform analysis, and draw practical conclusions.
  
- Proficiency in Microsoft Office applications (Excel, PowerPoint, Word).
  
- Familiarity with CAD tools (SolidWorks, Creo, NX, AutoCAD, TOPS, or similar) is a plus.
  
- Ability to work collaboratively in a team environment.
  
- Eagerness to learn and apply engineering fundamentals in a real-world setting.
  
- Demonstrated initiative, adaptability, and attention to detail.

## Role Details

  
- **Job:** Administration
  
- **Schedule:** Full time
  
- **Shift:** No shift premium (Singapore)
  
- **Travel:** Not specified
  
- **Relocation:** Not specified

## Applying to this role

This College Intern - Packaging Engineering role at HP runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications.

[Tailor this application](https://www.jorb.ai/signup?ref=job-atom&firm=hp&job=6a8e9e258f1f19514beb19e6)

## More open roles at HP

- [College Intern - New Product Introduction Engineering (NPI Mechanical/Mechatronics)](https://www.jorb.ai/jobs/6a8e9e258f1f19514beb19e1.md) – Singapore, posted 2d ago
- [College Intern - Process and Digitalization](https://www.jorb.ai/jobs/6a8e9e258f1f19514beb19ed.md) – Singapore, posted 2d ago
- [College Intern – System Engineer](https://www.jorb.ai/jobs/6a8e9e258f1f19514beb19ec.md) – Singapore, posted 2d ago
- [College Intern – Manufacturing Process Engineer](https://www.jorb.ai/jobs/6a8e9e258f1f19514beb19e9.md) – Singapore, posted 2d ago
- [College Intern - Product Engineering (Graphics)](https://www.jorb.ai/jobs/6a8e9e258f1f19514beb19eb.md) – Singapore, posted 2d ago

## Other open Mechanical Engineering roles

- [Wafer Sort/Final Test Thermal Mechanical hardware development Engineer Intern](https://www.jorb.ai/jobs/6a8d13e061add68db96c7de2.md) at [AMD](https://www.jorb.ai/firms/amd.md) – Singapore, posted 3d ago
- [Assistant Engineer, Mechanical-Gul Yard](https://www.jorb.ai/jobs/6a91789ba520c34ee1e92d7d.md) at [ST Engineering](https://www.jorb.ai/firms/st-engineering.md) – Singapore, posted 20d ago
- [Assoc Eng Equipment Engineering](https://www.jorb.ai/jobs/6a5a1c74a09a116221b5034f.md) at [GlobalFoundries](https://www.jorb.ai/firms/globalfoundries.md) – Singapore, posted 1mo ago
- [Assistant Engineer, Project, Ship Repair - Changi](https://www.jorb.ai/jobs/6a914065cfbc04ac9b378e21.md) at [ST Engineering](https://www.jorb.ai/firms/st-engineering.md) – Singapore, posted 1mo ago
- [Intern - F10 Probe Equipment](https://www.jorb.ai/jobs/6a44610b7659725d0d8c150e.md) at [Micron Technology](https://www.jorb.ai/firms/micron-technology.md) – Singapore, posted 1mo ago

---

Updated: 2026-08-28
Canonical: https://www.jorb.ai/jobs/6a8e9e258f1f19514beb19e6