# 2027 Masters ASIC Package Engineering Co-op/Intern [AMD](https://www.jorb.ai/firms/amd.md) · New York · United States · [Electrical Engineering](https://www.jorb.ai/jobs/electrical-engineering.md) AMD is hiring a 2027 Masters ASIC Package Engineering Co-op/Intern in New York. Posted 2026-08-25; applications close 2026-10-24. **Apply**: https://careers.amd.com/careers-home/jobs/91471 Posted 3d ago. ## Role details ## About AMD At AMD, we believe technology has the power to solve the world’s most important challenges—from advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day. Innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading-edge products to market, every role contributes to something bigger: technology that moves the world forward. As an AMD intern or co-op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. ## Job Details - **Location:** Austin, TX or Boxborough, MA; **summer only:** Fishkill, NY; Fort Collins, CO; Longmont, CO; or Secaucus, NJ - **Onsite/Hybrid:** Full time (40 hours/week) in a hybrid or onsite work structure throughout the co-op/intern term - **Duration:** - **Spring/Summer Co-op:** January 25, 2027 – August 13, 2027 - **Summer Internship:** - **Semester Schools:** May 24, 2027 – August 13, 2027 - **Quarter Schools:** June 21, 2027 – September 10, 2027 - **Summer-Fall Co-op:** - **Semester Schools:** May 24, 2027 – December 10, 2027 - **Quarter Schools:** June 21, 2027 – December 10, 2027 ## What You Will Be Doing We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our engineers to bring new and advanced packaging technology to reality. - Support Package Design and Package Development Engineers by prioritizing and optimizing new projects - Learn and complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates - Work on design verification implementation projects to support design performance, quality, and efficiency - Analyze yield and defect metrics to ensure design performance and help improve yield - Evaluate and benchmark packaging materials and interact with partners to achieve cost-efficient designs and materials that meet performance and yield requirements ## Who We Are Looking For - Currently enrolled in a US-based university in a Master’s program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field - Knowledge or experience in one or more of the following technical skills (or related areas): - Coursework related to transmission lines and electric circuits - Package, silicon, or PCB design software - Scripting languages: Perl / Python / SQL - Semiconductor theory and packaging process/technology - Data analytics and data visualization tools like Power BI **Note:** By submitting your application, you are indicating your interest in AMD intern positions. We are recruiting for multiple positions, and if your experience aligns with any of our intern opportunities, a recruiter will contact you. **This role is not eligible for visa sponsorship.** ## Benefits Benefits are described at AMD benefits at a glance. ## Applying to this role This 2027 Masters ASIC Package Engineering Co-op/Intern role at AMD runs through the firm's own careers portal and expects a CV and cover letter written specifically for the posting, not a portable submission carried across firms. Jorb AI's application agent tailors a CV and cover letter from your background to this posting and tracks the role alongside the rest of your applications. [Tailor this application](https://www.jorb.ai/signup?ref=job-atom&firm=amd&job=6a8d4c18fe37d1a1750dd5bd) ## More open roles at AMD - [2027 Masters Software Test Engineering Intern/Co-Op](https://www.jorb.ai/jobs/6a8d4c18fe37d1a1750dd5ba.md) – New York, posted 3d ago - [2027 Undergrad ASIC Package Engineering Co-op/Intern](https://www.jorb.ai/jobs/6a8d4c18fe37d1a1750dd5bc.md) – New York, posted 3d ago - [2027 Undergrad Software Test Engineering Intern/Co-Op](https://www.jorb.ai/jobs/6a8d4c18fe37d1a1750dd5bb.md) – New York, posted 3d ago - [Wafer Sort/Final Test Thermal Mechanical hardware development Engineer Intern](https://www.jorb.ai/jobs/6a8d13e061add68db96c7de2.md) – Singapore, posted 3d ago - [AI-intrinsic CPU/GPU Product Development with Design-Test-Manufacturing Co-optimization Intern](https://www.jorb.ai/jobs/6a8d13e061add68db96c7de3.md) – Singapore, posted 3d ago ## Other open Electrical Engineering roles - [College Intern - New Product Introduction Engineering (NPI IT Control Systems)](https://www.jorb.ai/jobs/6a8e9e258f1f19514beb19e8.md) at [HP](https://www.jorb.ai/firms/hp.md) – Singapore, posted 2d ago - [Process Engineer Intern](https://www.jorb.ai/jobs/6a8d4dced176e0df3fc64c60.md) at [Applied Materials](https://www.jorb.ai/firms/applied-materials.md) – Singapore, posted 3d ago - [\[2027 Internship\] Custom IC Layout Engineer Intern](https://www.jorb.ai/jobs/6a8dc69eaf665f12ac7e6a73.md) at [MediaTek](https://www.jorb.ai/firms/mediatek.md) – Singapore, posted 4d ago - [Field Service Engineer I](https://www.jorb.ai/jobs/6a8bc235b375d9131c6b789f.md) at [Honeywell](https://www.jorb.ai/firms/honeywell.md) – Singapore, posted 4d ago - [Manufacturing Test Technician (MDP MF)](https://www.jorb.ai/jobs/6a8bfc51d0d0ca7a2db22b57.md) at [Applied Materials](https://www.jorb.ai/firms/applied-materials.md) – Singapore, posted 4d ago --- Updated: 2026-08-28 Canonical: https://www.jorb.ai/jobs/6a8d4c18fe37d1a1750dd5bd