# Design for Manufacturing (DFM) R&D Intern

[Apple](https://www.jorb.ai/firms/apple.md) · Singapore · [Electrical Engineering](https://www.jorb.ai/jobs/electrical-engineering.md)

Apple is hiring a Design for Manufacturing (DFM) R&D Intern in Singapore. Posted 2026-03-09; applications close 2026-05-08.

**Apply**: https://jobs.apple.com/en-us/details/200648601/design-for-manufacturing-dfm-r-d-intern

Posted 1mo ago.

## Role details

## Summary

Apple is a place where extraordinary people come to do their best work. Just be ready to dream big. The people here don’t just build products — they build the kind of wonder that has revolutionized entire industries. It’s the diversity of people and ideas that inspires the innovation behind everything we do, from amazing technology to industry-leading environmental efforts. Join Apple and help us leave the world better than we found it. At Apple, creative ideas quickly become wonderful products, services, and customer experiences. Inside every product are some of the world’s most challenging consumer electronics packaging designs. Imagine yourself as part of a team that develops these assemblies from initial concept to prototyping for evaluating manufacturability. Bring passion and dedication to your job, and there’s no telling what you could accomplish.

## Description

This internship offers opportunities to work in a lab environment to develop distinctive package designs with intellectual property advantages while emphasizing practicality. The candidate will gain extensive experience in different facets of electronics packaging by working alongside experts and will learn about various process technologies to create a wide array of product designs. You will tackle tough challenges and work with specialists to explore highly innovative solutions while ensuring quality, reliability and cost efficiency.

## Minimum Qualifications

  
- Master’s or PhD in Electronics Engineering, Materials Science, or related areas
  
- Knowledge of electronics packaging technologies, passion for learning, and drive for innovation
  
- Strong persuasive communication and presentation skills
  
- Statistical analysis capability using software such as JMP or Tableau

## Preferred Qualifications

  
- Knowledge in SMT, molded SiP, and wafer-level packaging technologies is desirable
  
- Familiarity with PCB design and fabrication technologies is desirable
  
- Experience or knowledge in semiconductor failure analysis is a plus

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Updated: 2026-04-22
Canonical: https://www.jorb.ai/jobs/69aebbf97557ac791ade0750